Nexperia's LFPAK56D half-bridge MOSFETs offer 60% lower parasitic inductance and improved thermal performance

 Nexperia’s series of half-bridge (high-side and low-side) MOSFETs are constructed in the space-saving LFPAK56D package format. These MOSFETs occupy 30% lower PCB area compared to dual MOSFETs for 3-phase motor control topologies due to the removal of PCB tracks while permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilizes existing high-volume LFPAK56D assembly processes with proven automotive reliability. The package format uses flexible leads to improve overall reliability. An internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug-and-play style solution with exceptional current handling capability.

Features

· 60% lower parasitic inductance due to internal clip connection

· 30% space-saving on PCB compared to LFPAK56D dual

· High-performance ID max >60 A

· Low thermal resistance

Applications

· Handheld power tools, portable appliances, and space-constrained applications

· Brushless or brushed DC motor drives

· DC-to-DC systems

· LED lighting